PCB Specs

PCB-POOL®

Material construction

Standard-Industry-Quality FR4 1,5 mm (± 0,13 mm)

1. Soldermask 10 - 30 µm / each side

2. Plating Tin on Pads 10 - 15 µm HAL / 0,07µm ± 0,01 µm Chem. Ni/Au

3. Copper 30 - 50 µm / each side

4. Tin in Barrel 3 - 9 µm HAL / Chem. NiAu

5. Copper in Barrel 16 - 23 µm

Surface finish


	Layer build up	Thickness	Shelf life
ENIG (electroless nickel gold)	NiAu	Ni ˜ 4 - 8 µm AU ˜ 0,07 µm ± 0,01 µm	min. 12 Month
Hot Air Leveling (Lead free)	SnCu 0,7 Ni	˜ 10 µm	min. 12 Month

Gaps and widths

		mm/mil

Smallest drill / end diameter	A	0,200/8** 0,3/12	Minimal Standard

Minimum air gap	B	0,125/5* 0,15/6	Minimal Standard

Minimum track width	C	0,125/5* 0,15/6	Minimal Standard

Smallest annular ring on vias (/2 = min. ring around the drill - drillsize 0,2 mm - 0,49 mm drillsize)		(D - E)/ 2 0,125/5* 0,15/6	Minimal Standard

Smallest annular ring on component holes (/2 = min. ring around the drill - greater than 0,49 mm drillsize)		(F - G)/ 2 - 0,4/16	Minimal Standard

Minimum clearance for rout contour	H	- 0,3/12	Minimal Standard

Minimum clearance for npth holes	I	- 0,3/12	Minimal Standard

* extra charge applies. Option available with both HAL an Chem. Tin finish

** extra charge applies. Option available only with Chem. Nickel/Gold

Innerlayer


A) Smallest copper connection
0,125 mm
B) Minimum gap between drill and next copper information
0,3 mm

Soldermask

		Minimum mm/mil	Standard mm/mil
Minimum soldermask bridge	A	0,100 / 4	0,100 / 4
Minimum soldermask width	B	0,075 / 3	0,075 / 3
Minimum clearence to drills	C	0,125 / 5*	0,15 / 6
Minimum gap on solder surfaces	D	0,075 / 3	0,075 / 3
Soldermask layer thickness	F	0,02-0-05 / 0,8-2	0,02-0-05 / 0,8-2
Minimum soldermask layer thickness over tracks	G	0,008 / 0,3	0,008 / 0,3

*extra charge / ** extra charge - only Chemical Tin

Silkscreen

Silkscreen will be clipped back (to a diameter of 0,1 mm) from any corresponding soldermask pad in order to prevent pads being printed on (A).

Recommended:

(B) Minimum script thickness 0,125 mm

(C) Script height 2,00 mm

Scoring arrayed panels

Score angle	V	30° Scorer
Score depth	S	Depending on the material thickness tolerance ± 0,1 mm
Core thickness	K	0,3 mm / 12 mil tolerance ±0,1 mm
Gap from copper	A	min. 0,3 mm / 12 mil
Score tolerance	F	Tolerance ± 0,1 mm

* Based on the nominal center line
Min. single board size 5 mm x 5 mm
Min. multiup size 100 mm x 100 mm

Score pip

If a separate Layer has been created for routing and scoring, please inform us when ordering.

Calculation of multi-panels

Multiup, all boards <1 dm²

Required minimum area is 1 dm². If your PCBs are all smaller than 1 dm² we will automatically fill this area with as many boards as possible.

For a routing charge we will rout your boards singly. Please provide only one common contour if your boards should not be separated!

Alternatively a contour can be provided to the boards on pips and for a cam fee we will implement the routing path with pips. In these cases all charges (solder, pips etc.) will only be charged once.

Combined multiup with boards <1 dm² and boards >1 dm²

If the multi - up consists of boards <1 dm² and boards >1 dm² they will be manufactured and charged seperately:

Each board from any order which is >1 dm² will be charged a mask fee, all combined boards <1 dm² will be charged mask fee and one routing fee.

Important:

Using drills to pre-separate your multiup is not allowed, a routing contour with pips must be used instead.

Rout charges

	Internal cut-outs with a diameter or length greater than or equal to 6 mm.
	Boards <1dm² to be routed as single.

Routing

Design rules:

Almost any shape can be created by routing, however a few basic rules must be observed:

PCB-POOL® uses two types of routing bits: 1.0 mm and 2.0 mm.

All copper structures on the board must be 0.3 mm clear of the routing contour.

Plated drills on the edge of the PCB, which will be bisected by the contour line, must have a minimum diameter of 2.0 mm and have a remaining radius of 1.0 mm after routing (Fig. 1).

Outer contours can shape any angle while inner cutouts will produce at least the radius of the routing bit.

Production tolerance is +/- 0,1 mm (4mil).

Minimum Slotsizes

(A)

Minimum Slotsize:

1 mm x 2,5 mm (40 mil x 100 mil). The gap between start- and endpoint must be 0,5 mm (20 mil).

(B)

Minimum Slotsize:

2 mm x 5 mm (80 mil x 200 mil) The gap between start-and endpoint must be 1 mm (40 mil).

Routing boards on pips

Rout on pips

PCB-POOL® can rout your boards on a multipanel, held together by break-off pips. The boards are easy to separate manually, e.g. after reflow soldering. The pips are 1.0 mm in width and the minimum gap between each board on the multipanel is 2.0 mm.

Please note that there is an extra charge of € 30.17 ex VAT for this service. Even if the multi-panel contour is provided with the layout files, the routing program still has to be created and manually customized by our Cam departement.

Routing board on pips < 20 mm x 20 mm

For reasons of quality assurance, we will rout boards ≤ 20 mm x 20 mm on a frame.

No additional charge (rout on pips) will be applied.

Routing directions

The exact outer margin of the rout contour is defined by the middle of the trace used to designate the board edge; the radius of the routing bit will be adjusted to compensate.

Drilling tolerances

Drills can generaly be catagorized as:
- Mounting holes (for fixing of PCB)
- Via (produce electrical contact between component and solderside or different layers of PCB)
- Component hole

Our smallest drill diameter in PCB-POOL® is 0,2 mm (8 mil), the largest drill diameter 6,0 mm.
All drill diameters > 6,0 mm (248 mil) count as rout contour!
Pips (used to hold PCBs in a panel) can be created with a diameter < 1 mm (40 mil)

Important:

Non plated trough holes have to be exposed 0,5 mm from the copper (copper planes or tracks).

Tolerances

Ø/mm	Ø/mil	Tolerance/mm	Tolerance/mil	pth/npth

0,2 - 0,6	8 -24	0,1	4	Plated
0,6 - 2,0	24 - 79	0,1	4	Plated
2,0 - 0,6	79 - 236	0,15	6	Plated
> 6,0	> 236	0,2	8	Plated

6,0 - 6,3	8 - 248	0,1	4	NonPlated
> 6,3	> 248	0,2	8	NonPlated

Overlapping drills cannot be produced dimensionally stable.

If there are slots required, create as a rout contour.

Drill chart table

pcbpool

Drill chart table PTH to 2mm
Drillendsize		Rounding	Toolsize
from	to	Rounding	Toolsize
Via holes
0,20	0,25	0,25	0,25
0,26	0,50	0,50	0,40
Component holes
0,51	0,54	0,55	0,70
0,55	0,59	0,60	0,75
0,61	0,64	0,65	0,80
0,65	0,69	0,70	0,85
0,71	0,74	0,75	0,90
0,75	0,79	0,80	0,95
0,81	0,84	0,85	1,00
0,85	0,89	0,90	1,05
0,91	0,94	0,95	1,10
0,95	0,99	1,00	1,15
1,01	1,04	1,05	1,20
1,05	1,09	1,10	1,25
1,11	1,14	1,15	1,30
1,15	1,19	1,20	1,35
1,21	1,24	1,25	1,40
1,25	1,29	1,30	1,45
1,31	1,34	1,35	1,50
1,35	1,39	1,40	1,55
1,41	1,44	1,45	1,60
1,45	1,49	1,50	1,65
1,51	1,54	1,55	1,70
1,55	1,59	1,60	1,75
1,61	1,64	1,65	1,80
1,65	1,69	1,70	1,85
1,71	1,74	1,75	1,90
1,75	1,79	1,80	1,95
1,81	1,84	1,85	2,00
1,85	1,89	1,90	2,05
1,91	1,94	1,95	2,10
1,95	1,99	2,00	2,15

Drill chart table PTH from 2mm to 6mm

Drillendsize		Rounding	Toolsize
from	to	Rounding	Toolsize
2,00	2,09	2,05	2,20
2,10	2,19	2,15	2,30
2,20	2,29	2,25	2,40
2,30	2,39	2,35	2,50
2,40	2,49	2,45	2,60
2,50	2,59	2,55	2,70
2,60	2,69	2,65	2,80
2,70	2,79	2,75	2,90
2,80	2,89	2,85	3,00
2,90	2,99	2,95	3,10
3,00	3,09	3,05	3,20
3,10	3,19	3,15	3,30
3,20	3,29	3,25	3,40
3,30	3,39	3,35	3,50
3,40	3,49	3,45	3,60
3,50	3,59	3,55	3,70
3,60	3,69	3,65	3,80
3,70	3,79	3,75	3,90
3,80	3,89	3,85	4,00
3,90	3,99	3,95	4,10
4,00	4,09	4,05	4,20
4,10	4,19	4,15	4,30
4,20	4,29	4,25	4,40
4,30	4,39	4,35	4,50
4,40	4,49	4,45	4,60
4,50	4,59	4,55	4,70
4,60	4,69	4,65	4,80
4,70	4,79	4,75	4,90
4,80	4,89	4,85	5,00
4,90	4,99	4,95	5,10
5,00	5,09	5,05	5,20
5,10	5,19	5,15	5,30
5,20	5,29	5,25	5,40
5,30	5,39	5,35	5,50
5,40	5,49	5,45	5,60
5,50	5,59	5,55	5,70
5,60	5,69	5,65	5,80
5,70	5,79	5,75	5,90
5,80	5,89	5,85	6,00

Drill chart table NPTH to 2mm

Drillendsize		Rounding	Toolsize
from	to	Rounding	Toolsize
0,50	0,54	0,50	0,60
0,55	0,59	0,55	0,65
0,60	0,64	0,60	0,70
0,65	0,69	0,65	0,75
0,70	0,74	0,70	0,80
0,75	0,79	0,75	0,85
0,80	0,84	0,80	0,90
0,85	0,89	0,85	0,95
0,90	0,94	0,90	1,00
0,95	0,99	0,95	1,05
1,00	1,04	1,00	1,10
1,05	1,09	1,05	1,15
1,10	1,14	1,10	1,20
1,15	1,19	1,15	1,25
1,20	1,24	1,20	1,30
1,25	1,29	1,25	1,35
1,30	1,34	1,30	1,40
1,35	1,39	1,35	1,45
1,40	1,44	1,40	1,50
1,45	1,49	1,45	1,55
1,50	1,54	1,50	1,60
1,55	1,59	1,55	1,65
1,60	1,64	1,60	1,70
1,65	1,69	1,65	1,75
1,70	1,74	1,70	1,80
1,75	1,79	1,75	1,85
1,80	1,84	1,80	1,90
1,85	1,89	1,85	1,95
1,90	1,94	1,90	2,00
1,95	1,99	1,95	2,05
2,00	2,04	2,00	2,10

Drill chart table NPTH from 2mm to 6mm

Drillendsize		Rounding	Toolsize
from	to	Rounding	Toolsize
2,10	2,19	2,10	2,20
2,20	2,29	2,20	2,30
2,30	2,39	2,30	2,40
2,40	2,49	2,40	2,50
2,50	2,59	2,50	2,60
2,60	2,69	2,60	2,70
2,70	2,79	2,70	2,80
2,80	2,89	2,80	2,90
2,90	2,99	2,90	3,00
3,00	3,09	3,00	3,10
3,10	3,19	3,10	3,20
3,20	3,29	3,20	3,30
3,30	3,39	3,30	3,40
3,40	3,49	3,40	3,50
3,50	3,59	3,50	3,60
3,60	3,69	3,60	3,70
3,70	3,79	3,70	3,80
3,80	3,89	3,80	3,90
3,90	3,99	3,90	4,00
4,00	4,09	4,00	4,10
4,10	4,19	4,10	4,20
4,20	4,29	4,20	4,30
4,30	4,39	4,30	4,40
4,40	4,49	4,40	4,50
4,50	4,59	4,50	4,60
4,60	4,69	4,60	4,70
4,70	4,79	4,70	4,80
4,80	4,89	4,80	4,90
4,90	4,99	4,90	5,00
5,00	5,09	5,00	5,10
5,10	5,19	5,10	5,20
5,20	5,29	5,20	5,30
5,30	5,39	5,30	5,40
5,40	5,49	5,40	5,50
5,50	5,59	5,50	5,60
5,60	5,69	5,60	5,70
5,70	5,79	5,70	5,80
5,80	5,89	5,80	5,90
5,90	5,99	5,90	6,00

Bohrdurchmesser		Rundung	Werkzeug
von	bis	Rundung	Werkzeug
0,50	0,54	0,50	0,60
0,55	0,59	0,55	0,65
0,60	0,64	0,60	0,70
0,65	0,69	0,65	0,75
0,70	0,74	0,70	0,80
0,75	0,79	0,75	0,85
0,80	0,84	0,80	0,90
0,85	0,89	0,85	0,95
0,90	0,94	0,90	1,00
0,95	0,99	0,95	1,05
1,00	1,04	1,00	1,10
1,05	1,09	1,05	1,15
1,10	1,14	1,10	1,20
1,15	1,19	1,15	1,25
1,20	1,24	1,20	1,30
1,25	1,29	1,25	1,35
1,30	1,34	1,30	1,40
1,35	1,39	1,35	1,45
1,40	1,44	1,40	1,50
1,45	1,49	1,45	1,55
1,50	1,54	1,50	1,60
1,55	1,59	1,55	1,65
1,60	1,64	1,60	1,70
1,65	1,69	1,65	1,75
1,70	1,74	1,70	1,80
1,75	1,79	1,75	1,85
1,80	1,84	1,80	1,90
1,85	1,89	1,85	1,95
1,90	1,94	1,90	2,00
1,95	1,99	1,95	2,05
2,00	2,04	2,00	2,10

Layer build ML 4

	Qty	TypeNo	Type	Thickness/Prepreg
	1	7628	Layer 1 Prepreg	0,18 mm
	1	2125	Prepreg	0,10 mm
	1	2125	Prepreg	0,10 mm
	4	7628	Layer 2 Prepreg Layer 3	0,71 mm
	1	2125	Prepreg	0,10 mm
	1	2125	Prepreg	0,10 mm
	1	7628	Prepreg Layer 4	0,18 mm
Layer 1; Copper foil 18 µm; Thickness after galvanic plating 35 µm Layer 2; Copper 35 µm; Layer 3; Copper 35 µm Layer 4; Copper foil 18 µm; Thickness after galvanic plating 35 µm Panel thickness: 1,576 mm Panel thickness after galvanicline: 1,612 mm Tolerance: ± 0,1 mm For impedance controlled multilayer boards please request a PCB-OVERSEAS quotation, as layer build can vary by manufacturer.

Layer build ML 4 - 1 mm

	Qtyl	TypeNo.	Type	Thickness/Prepreg
	1	2125	Layer 1 Prepreg	0,10 mm
	1	2125	Prepreg	0,10 mm
	1	2125	Prepreg	0,10 mm
	2	7628	Layer 2 Prepreg Layer 3	0,36 mm
	1	2125	Prepreg	0,10 mm
	1	2125	Prepreg	0,10 mm
	1	2125	Prepreg Layer 4	0,10 mm
Layer 1; Copper foil 18 µm; Thickness after galvanic plating 35 µm Layer 2; Copper 35 µm; Layer 3; Copper 35 µm Layer 4; Copper foil 18 µm; Thickness after galvanic plating 35 µm Panel thickness: 1,062 mm Panel thickness after galvanicline: 1,097 mm Tolerance: ± 0,1 mm For impedance controlled multilayer boards please request a PCB-OVERSEAS quotation, as layer build can vary by manufacturer.

Layer build ML 6

	Qty	TypeNo.	Type	Thickness/Prepreg
	1	2125	Layer1 Prepreg	0,10 mm
	1	2125	Prepreg	0,10 mm
	2	7628	Layer2 Prepreg Layer3	0,36 mm
	1	7628	Prepreg	0,18 mm
	1	2125	Prepreg	0,10 mm
	2	7628	Layer4 Prepreg Layer5	0,36 mm
	1	2125	Prepreg	0,10 mm
	1	2125	Prepreg Layer6	0,10 mm
Layer 1; Copper foil 18 µm; Thickness after galvanic plating 35 µm Layer 2; Copper 35 µm; Layer 3; Copper 35 µm; Layer 4; Copper 35 µm; Layer 5; Copper 35 µm; Layer 6; Copper foil 18 µm; Thickness after galvanic plating 35 µm Panel thickness: 1,576 mm Panel thickness after galvanic line: 1,612 mm Tolerance: ± 0,1 mm

Positioning of UL quality mark

Please inform us when placing your order if a UL quality mark is required on your PCBs.

Please clearly indicate the area where you wish to have the UL logo positioned. The perimeter for the quality mark must be 13 mm x 9 mm , this border line will be deleted by the CAM engineer prior to production. The UL-quality mark will be added to the silkscreen (if requested) or soldermask layer. Placement of the UL logo on the copper layer is possible, but only when specifically requested by the customer.

Free Stencil

Should your PCB layout contain surface mount devices (SMD), you can order a laser stencil to the following specifications.This type of stencil is free when you place a prototype order and it is available at an especially low price when you place a series order.

Stainless-Steel 127 µm
Size to be 10 mm (all around) larger than the PCB
10% pad reduction
No finishing

The paste film data wil be generated from your PCB Layout data.

The current carrying capacity of cu-tracks on base material

Example:
A track 1.5 mm wide on 35 µm copper will heat to approx. 10°C above room temperature when a 3 amp current is applied. These values may vary greatly depending on the structure of the board and on the enviroment and air circulation.

Thickness copper layer	Track width	Max. current depending on temperature increase
Temperature		10°C	20°C	30°C	45°C	60°C
35µm	0,25 mm	0,5A	0,8A	1,0A	1,3A	1,6A
	0,50 mm	1,0A	1,6A	2,0A	2,5A	3,0A
	1,00 mm	2,2A	3,0A	3,6A	4,2A	4,8A
	1,50 mm	3,0A	3,8A	4,6A	5,3A	6,5A
	2,00 mm	3,8A	5,0A	6,5A	7,5A	8,5A
	3,00 mm	4,5A	6,5A	8,0A	9,5A	11A
	4,00 mm	6,0A	8,5A	10A	12A	13,5A
	5,00 mm	7,0A	10A	12A	14,5A	16A
	6,00 mm	7,5A	11A	14A	16A	18A
	8,00 mm	9,0A	14A	17A	2A	22,5A
	10,00 mm	10A	16A	20A	23A	26A
70µm Only Non-POOL available	0,25 mm	0,5A	1,6A	2,0A	2,5A	3,0A
	0,50 mm	2,0A	2,8A	3,5A	4,0A	4,5A
	1,00 mm	3,5A	4,7A	5,8A	6,8A	8,0A
	1,50 mm	4,5A	6,2A	7,5A	9,0A	10,5A
	2,00 mm	6,0A	8,5A	10A	12A	13,5A
	3,00 mm	7,5A	11A	14A	16A	18A
	4,00 mm	9,0A	13,5A	17A	19A	22A
	5,00 mm	10A	15A	19A	23A	25A
	6,00 mm	11A	18A	22A	26A	28A

Insulated Metallic Substrate PCB

PCB-Type	Single sided
Min. drill endsize	1,0 mm
Min. tracksize	0,125 mm
Min. airgap	0,125 mm
Soldermask	Green/White/Black
Silkscreen	White/Black
Surface	HAL leadfree
Gap from contour to copper	0,3 mm
Contour Processing	Routing
Copper thickness	0,035 mm
Dielectric substrate	0,1 mm
Carrier material / Aluminium	1,5 mm

Optional it is possible to have depth milling, drills with threads (extra charge applies).

This data must be supplied in a separate DXF or Target Frontpanel Designer file.

IMS Buildup

Core Material	Manufacturer
Polytherm TC-Lam 1.3	MSC-Polymer
Thickness Dielectric	Protective film
100µm	HT (High Temperature ≤280°C)

Technical advise

Keepout to contour

Routing through the copperarea can often create a burr. To get a better finish please create a gap between contour and signal "Keepout".
Soldermask bridges

Ensure that the bridges of soldermask are at least 0,1mm.
Layer definition

To define the correct view, please create a signature. For this you can use "CS", "SS", "top" or "bot". Also you can use the board name. The PCB will be processed so that the text is readable.
Silkscreen clipping

(left) Correct positioning of silkscreen, after the clipping the text is complete. (center and right) Unfavorable position of silkscreen. After the clipping process the text is not readable.
Eagle: correct text position


For a correct size of the text by gerber output have the texts in copper and assembly files, either as a vector font to be defined, or see "Options- User Interface - Options - Always vector font" and "Persistant in this drawing" selected

Design Rules

Altium Dru file

Eagle Dru file

Layer lists

Layerlist Target

	Layerfunction	Layer No.
	Drills	24
	Contour and add. routings	23
	Topside/BS **	14 - 16
	Innerlayer 1**	11 - 13
	Innerlayer 2**	8 - 10
	Bottomside/LS **	0 - 2
	Soldermasktop/ BS	18
	Soldermask bot/LS	4
	Silkscreen top*	21
	Silkscreen bot*	7
	* Inclusive t-names and values if created ** Please ensure the assignment of the reference levels to ensure the correct edition of the ground plane Please note: If additional or different Layers are used, please specify this on your order.

Layerlist Eagle

Component Side (CS)

1 Top

17 Pads

18 Vias

Innerlayer 4ML

Route 2+15

Innerlayer 6ML

Route 2+3*14+15

Solder Side (SS)

16 Bottom

17 Pads

18 Vias

Contour and add. routings

20 Dimension

Silkscreen CS

21 tPlace

25 tNames

Silkscreen SS

22 bPlace

26 bNames

Soldermask CS

29 tStop

Soldermask SS

30 bStop

Paste CS

31 tCream

Paste SS

32 tCream

Drills pth

44 Drills

Holes npth

45 Holes

Please Note: If additional or different layers are used, please specify this on your order

The setting for covering vias can be found under "edit - design rules" and adjusted under "mask - limit"

For a correct (size) of the text by gerber output

have the texts in copper and assembly files, either as a vector font to be defined, or see "Options -
User Interface "options" Always vector font "and" persistant in this drawing" selected.

The safe method is, however, the texts themselves to be defined as vector font, as you may manually, or by a SCRIPT can pick the option "Always vector font", with
VECTOR_FONT SET OFF;

Moreover, in the Design Rules tab in the "Misc" "Check Fonts" option enabled, then the texts are in copper layers are not defined as a vector font, according to outputs as errors.

Layerlist Altium

T - Component Side

B - Solder Side

P - Innerlayer 1

G - Innerlayer 2

Top Solder

Soldermask Component Side

Bottom Solder

Soldermask Solder Side

Keep-Out Layer

Will be used if there are no mechanical layer available

Mechanical Layer

Contour and add. routings

Top Paste

Will be used for Stencil component side

Bottom Paste

Will be used for Stencil component side

Layerlist Sprint Layout

Sprint Layout Layerlist

K1 Copperside 1 – Coppertop

B1 Silkside 1 – Silkscreentop

K2 Copperside 2 – Copperbot

B2 Silkside 2 – Silkscreenbot

U Own layer for Boardcontour

I1 Inner Layer 1 (Multilayer-Boards)

I2 Inner Layer 2 (Multilayer-Boards)

Extract from the Sprint Layout 5.0 Tutorial
Sprint-Layout supports 7 different layers. A layer can be thought of as a transparent film. You can create several layers one above the other (visible) and thus consider the same layer.
...
The top and bottom of the board each have two separate layers. One for the actual layout and an extra for an optional silkscreen. The colors of each layer can be freely defined.

When designing your layout, please note the following points:

The board side 1 is the top of the board.
The board side 2 is the bottom of the board.
You develop your layout easy perusal, as if you had a board made of glass.
Note that the components and text on the bottom of boardside 2 must be mirrored (sprint layout makes it a rule automatically for you).

Layerbelegungsliste KiCad

Kupferlagen

- Vorderseite

- Rückseite

Stopplack

- Lötstoppmaske vorderseite

- Lötstoppmaske rückseite

Positionsdruck

- Siebdruck vorderseitig*

- Siebdruck rückseitig*

Kontur und Innenausfräsungen

- Platinumrisse

Die Ausgabe der Positionsdrucke erfolgt inklusive der unter Elemente angegebenen Texte.

Format for ext. Gerber Files in PCB-POOL®

Please supply us with a separate data file for each layer of the required pcb.

RS274X Format / Extended Gerber

	Single sided	Double sided	4-Layer	6-Layer
Drill	X	X	X	X
Top Side		X	X	X
innerlayer1			X	X
Innerlayer2			X	X
Innerlayer3				X
Innerlayer4				X
Bot Side	X	X	X	X
Top Soldermask		X	X	X
Bot Soldermask	X	X	X	X
Top Silkscreen	X	X	X	X
Bot Silkscreen	X	X	X	X
Board Outline	X	X	X	X

These data files must be clearly labeled.

Drill	Sieb+Meyer	Excellon
Whole Digits	3	2
Precision	2	4
Zero Suppression	Leading	Leading
Units	mm	inch
Coordinates	abs	abs

The drill sizes must either be embedded in the drill data or supplied in a separate tool list.
All hole sizes are finished hole sizes.

It is in your own best interest to supply the data in the format we require. Failure to do so may result in us putting your order on hold and your delivery date will be affected accordingly.

PCB assembly

Instructions

Amount:	Prototype and small series, 1 to 50 pieces Larger quantities available on request.
PCB dimensions:	For reasons of quality assurance, printed circuit boards ≤ 20mm x 20 mm are manufactured and delivered on a panel (printed circuit board holder). No additional costs are involved here (Break-off pips routing charge). Maximum: 430 mm x 380 mm
Components:	SMD and THT from size 0402 and up SOIC, PLCC, TSOP, QFP, BGA
Assembly method:	single-and double-sided SMD (soldered by Vapour Phase Reflow Soldering machine) THT (soldered manually or by Selective Soldering machine)
Component packaging:	Tape strip Sticks Reels Bulk material (please request only in exceptional cases and only when a maximum of 2 PCBs are being assembled)
Maximum component size:	55 mm x 55 mm x 15 mm Fine Pitch from 0,5 mm Minimum Pin width 0,2 mm
Solder:	Leadfree and conforming to DIN 32513, ISO, EN 29454, IPC 650
File formats:	At present: EAGLE and TARGET3001!, for other formats, please contact us.
Delivery time:	10 working days starting from the day on which all the components required for assembly arrive or 14 working days for the assembly of 1000 or more components
Tip:	For technical reasons, the printed circuit boards to be assembled are manufactured in panels. Identical printed circuit boards, which are not going to be assembled, are therefore also supplied in this way. For passive 0603 components or larger, please supply us with a 20% surplus (min. 10pcs). For 0402 components, please supply a 100% surplus (min. 20pcs). If a component should not fit in the planned footprint, or not be possible to assemble for some other reason, we will be obliged to continue the assembly process without this component and kindly ask for your understanding in this matter. Unfortunately we can only accept distributors with an online ordering facility (Shopping basket) and transactions in EURO currency.

Creating BOM (Bill of material) with Eagle

Creating BOM (Bill of material) with Target
Creating BOM (Bill of material) with Altium

Downloads

Assembling - Eagle - Manual BOM

Assembling - Eagle - Beta LAYOUT Stock and ULP

Assembling - Target - Manual BOM

Assembling - Target - Beta LAYOUT Stock

Assembling - Altium - Manual BOM

Assembling - Extended Gerber - Manual

Assembling Beta Stock

Datasheets

Datasheets Printed Circuit Board

Soldermask PROBIMER 77

Basematerial SHANGHAI NANYA SN-L4 FR4 NY1140

Leadfree Tin SN100CL

Ormecon® Chemical Tin

IMS Core material

IMS Soldermask black

IMS Soldermask white

Basismaterial Isola DE 104 ML-3

Basismaterial Huazheng H140A DS

Fits-or-Not

Fileformat Mentor IDF V3

Frontpanel Digitalprint

Durability of digital printing of Front Panels
The manufacturer guarantees the durability of the certified materials on the basis of the DIN 30643 (Wiping and Abrasion resistance of Inscriptions on Signage). Furthermore the durability was tested using acetone, cold cleaning fluid, oil, hat and superheated steam.
UV tests with a determined durability of 5 to 8 years were accomplished for anodized aluminium. None of the materials presented any changes visible to the naked eye after testing. Measureable discolourations are particularly present with the colours black and blue.

MAGIC-PCB®

MAGICSTRAP Technical Data Sheet (PDF)

MAGICSTRAP Application Note 08/2011 (PDF)

HELPINFORMATION "Embedded RFID" (PDF)

MAGICSTRAP Reference Designfor edge placement 03_2013 (PDF)

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Specifications